Touch Taiwan 2026 Report – EP3: AI Data Center Optoelectronics and Scalable Optical Interconnect Architecture
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As AI workloads continue to scale, data centers are rapidly transitioning toward high-speed, low-power optical interconnects to overcome the bandwidth and thermal limitations of traditional copper. At Touch Taiwan 2026, Ennostar presented a datacom-focused portfolio that addresses these challenges through a multi-technology optical architecture, spanning Micro LED, VCSEL, and DFB laser solutions.
A Multi-Range Optical Framework for AI Infrastructure
A central theme of Ennostar’s showcase was the alignment of different light source technologies to specific transmission distances:
Micro LED: For ultra-short reach (<10m).
VCSEL: For short- to mid-range (<100m).
DFB Lasers: For extended reach and high-bandwidth networks (2000m).
This multi-range architecture reflects real AI data center requirements, where interconnect design must balance speed, power consumption, and thermal constraints across different layers.
Micro LED: The Future of Ultra-Low Power Intra-Rack Interconnects
For ultra-short reach applications such as intra-rack data transmission in AI servers, Ennostar showcased its Micro LED-based solutions. While this remains an emerging technology in the datacom space, its R&D potential is significant due to:
Ultra-low power consumption: Potential to reduce system energy load to<1 pJ/bit.
High thermal tolerance: Capability to withstand up to 125°C, ensuring reliability in dense, high-heat compute environments.
Signal Integrity Validation: To demonstrate communication viability, Ennostar presented a live eye diagram of Micro LED signals, showing clear eye opening and stable transmission under high-speed operation.
Demonstrated Component Specifications: These building blocks were implemented on glass interposer platforms co-developed with AUO. To support a wide range of integration possibilities, Ennostar is also exploring alternative interposer material systems, further advancing performance optimization and scalable deployment.
Component | Resource | Key Specs | Count |
| Tx Array / Lens | Ennostar – Blue LED Emitter | TIR (Total Internal Reflection) lens | 158 LED |
| Tx / Fiber Assembly | Ennostar – Blue LED Emitter | Silica fiber, ~1 mm diameter | 158 LED |
| Rx Array | Tyntek – PD Receiver | High light reception efficiency | 158 PD |
VCSEL: Efficient Scaling for Short-Reach Datacom
For distances up to 100 meters, Ennostar presented its latest VCSEL (Vertical-Cavity Surface-Emitting Laser) solutions, designed to deliver high-speed data transmission with lower power consumption and enhanced thermal management. The solutions are well-suited for deployment in high-density optical modules and Active Optical Cables (AOCs) across data center and HPC applications.
DFB Lasers: Supporting 800G and 1.6T Roadmap
For longer-reach requirements, Ennostar introduced 1310nm DFB (Distributed Feedback) laser solutions.
High Bandwidth: These solutions currently support 800G OSFP DR8 transceivers, with a clear roadmap toward 1.6T.
Silicon Photonics Compatibility: Featuring high-power, single-mode output, these lasers are designed for seamless integration with silicon photonics platforms.
Ecosystem Collaboration: Advancing CPO Development
A key highlight of the exhibit was Ennostar’s collaboration with ecosystem partners AUO and Tyntek to showcase modules aligned with Co-Packaged Optics (CPO) development. Furthermore, Ennostar contributed to the Co-Packaged Optics Technology Forum, sharing insights on how Micro LED technology can address the critical industry challenges of power efficiency and high-density integration.
By leveraging Micro LED, VCSEL, and DFB solutions across different distance applications, Ennostar is enabling a practical, energy-efficient pathway for the next wave of AI-driven data centers.
The high level of engagement at our Datacom booth (pictured above) underscores the industry's urgency in finding scalable, energy-efficient solutions for the AI era.
