Product Features

Equipped with micro LED chips delivering high contrast and high-resolution image quality

Ultra-thin packaging technology (<120 µm) enables ultra-slim end-product display designs

Supports passive-matrix driving current, and is compatible with multiple driving methods for greater design flexibility

Competitive Strengths

• Ultra-compact micro RGB technology for higher black ratio and richer color saturation
• Industry-leading RDL packaging for enhanced precision and reliability
• Ultra-thin design with wide viewing angle, low color shift, and clear performance in dynamic displays
   

i-Pixel Highlights

• Wide viewing angles with no color shift for perfectly rendered images
• High reliability enabled by semiconductor-grade precision processing
• Ultra-miniaturized packaging delivers high-resolution display solutions ideal for large indoor displays

COA：Delivers consistent, accurate colors from any angle 

Tech Highlight

Tech Highlight 1： 6/8-inch Wafer-level package with RDL process

Note：WLP : Wafer Level Packaging

Tech Highlight 2：Comprehensive mass transfer technologies

Stamp Transfer

Laser Transfer

Fluidic Transfer

Module Spec Reference

Pixel Pitch	0.9375mm
LED Package	200*200 um2
Display Resolution	1920*1080 Pixel
Brightness	>1000 nits
Black Surface Ratio	>97%