With the rapid advancement of artificial intelligence (AI), the demand for data transmission and processing is growing at an astonishing rate. Optical interconnects have become a crucial technology in the AI era. Ennostar has developed three core AI optical interconnect technologies, providing essential support for AI training, data centers, high-performance computing (HPC), and IoT applications, thereby driving a revolution in information transmission.
- Micro LED (A Cost-Effective Solution for Short-Range Transmission Within 10 Meters): Micro LED transmission offers low cost, high-temperature resistance (up to 125°C), a long lifespan (over 30,000 hours), and ultra-low power consumption (<1 pJ/bit). These characteristics make it ideal for high-speed transmission within 10 meters. Ennostar plans to gradually boost Micro LED data transmission speeds from 1 Gbps in 2025 to 8 Gbps by 2028.
- VCSEL (An Optimal Cost-Efficiency Solution for Mid-Range Transmission): VCSEL is a suitable solution for high-speed internal AI server transmission. In addition, VCSELs are the most widely used optical sources, benefiting from a mature supply chain and ease of optical integration. Ennostar will roll out 100 Gbps transmission products and continue developing next-generation 200 Gbps solutions to meet the growing demand for faster and more efficient AI server interconnects.
- CW-DFB LD (An Efficient Solution for Long-Range Transmission): Utilizing InP material, Ennostar's high-power continuous-wave distributed feedback laser diode (CW-DFB LD) supports long-range transmission, making it ideal for data center interconnects and fiber-optic connections. It can also serve as an external light source (ELS) for co-packaged optics (CPO) architectures, leveraging silicon photonics to optimize short-range fiber connectivity. Ennostar aims to increase its output power from 70 mW in 2025 to 200 mW by 2028 while enhancing short-range fiber connectivity through silicon photonics technology.
Market forecasts indicate that by 2028, global data traffic will increase sevenfold, while energy consumption must be reduced to just one-tenth of current levels to meet green computing demands. Due to the limitations of traditional copper-based transmission, the shift from copper to optical solutions has become an irreversible industry trend. As a global leader in optoelectronic solutions, Ennostar leverages its expertise in III-V semiconductor technology to actively develop VCSEL, CW-DFB LD, and Micro LED as the three key AI optical interconnect light sources, developing high-efficiency, low-power optical interconnect technologies to meet the urgent demands for high-speed data transmission in the AI era.
Ennostar will debut its latest AI optical interconnect innovations at Touch Taiwan 2025 from April 16 to 18. Moving forward, Ennostar will continue strengthening its roadmap for AI optical interconnect technologies, enhancing optoelectronic integration capabilities, and driving further maturation and widespread adoption of optical interconnect technologies in the AI era.
▶Touch Taiwan 2025 Ennostar's Event Website
▶Touch Taiwan 2025 Visitor Pre-registration
